China's Tongfu Microelectronics reportedly begins HBM2 trial assembly
[Digitimes] - 02/3/2025
According to a report by Nikkei, Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory (HBM2). This development follows fellow Chinese manufacturer ChangXin Memory Technologies (CXMT) starting its own HBM2 production, suggesting a potential expansion of (…)
In Taiwanese newspapers
Apple scraps work on Mac-connected augmented reality glasses
Apple Inc. has canceled a project to build advanced augmented reality glasses that would pair with its devices, (…)
[Digitimes] - 3/02/2025
Cadence Design Systems has said that it recognizes India as a critical hub for innovation and data-driven growth and (…)
[Digitimes] - 3/02/2025
