U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
[Digitimes] - 11/21/2024
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects aim to develop cutting-edge technologies in advanced substrates, a critical component in the semiconductor (…)
In Taiwanese newspapers
Labor minister offers resignation over bullying suicide case
Taipei, Nov. 21 (CNA) Labor Minister Ho Pei-shan (何佩珊) offered to resign on Wednesday evening over her handling of a (…)
[Focus Taiwan] - 21/11/2024
'Taiwan Travelogue' wins U.S. National Book Award for Translated Literature
Washington, Nov. 20 (CNA) The English translation of Yang Shuang-zi's (楊双子) Taiwan Travelogue (臺灣漫遊錄) made history (…)
[Focus Taiwan] - 21/11/2024
SSD sales have been buoyed by specifications upgrades, according to industry sources, while DRAM module sales have (…)
[Digitimes] - 21/11/2024
