Samsung expands Suzhou packaging investments to bolster HBM competitiveness

Samsung expands Suzhou packaging investments to bolster HBM competitiveness

[Digitimes] - 11/21/2024

Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and its Samsung Electronics Suzhou Semiconductor (SESS) plant in China is receiving new semiconductor production tools. (…)



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