Samsung expands Suzhou packaging investments to bolster HBM competitiveness
[Digitimes] - 11/21/2024
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and its Samsung Electronics Suzhou Semiconductor (SESS) plant in China is receiving new semiconductor production tools. (…)
In Taiwanese newspapers
TSMC quietly forms advanced packaging supply chain cluster in Southern Taiwan
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in (…)
[Digitimes] - 21/11/2024
Inside TSMC II: Nvidia's 40nm crisis and Morris Chang's solution
The supreme quality of leadership is integrity. —Dwight D. Eisenhower.
[Digitimes] - 21/11/2024
Taiwan shares close down 0.58%
Taipei, Nov. 21 (CNA) Taiwan shares ended down 132.70 points, or 0.58 percent, at 22,555.66 Thursday on turnover of (…)
[Focus Taiwan] - 21/11/2024