GPTC sees wet process equipment orders soar on advanced packaging boom in 2025
[Digitimes] - 11/19/2024
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand Process Technology (GPTC) anticipates strong orders from TSMC, ASE Technology Holding, and overseas clients. Market (…)
In Taiwanese newspapers
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