TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty
[Digitimes] - 11/18/2024
Rising global uncertainties following Donald Trump's presidential victory have led TSMC to recalibrate its ambitious expansion plans for Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, particularly as the semiconductor industry faces new geopolitical challenges.
In Taiwanese newspapers
Lows of 14 degrees forecast for northern Taiwan next week
Taipei, Nov. 21 (CNA) Seasonal northeasterly winds may strengthen to a cold air mass and push temperatures in (…)
[Focus Taiwan] - 21/11/2024
Peripheral chip vendors have received a boost from Nvidia's announcement that it is accelerating shipments for its (…)
[Digitimes] - 22/11/2024
While Nvidia's latest financial report garnered attention for its strong earnings, the focal point was its declining (…)
[Digitimes] - 22/11/2024
Thunder Tiger Technology, a leading drone manufacturer in Taiwan, has revealed impressive achievements at this (…)
[Digitimes] - 22/11/2024
